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NCS2510 1.4 GHz Current Feedback Op Amp
NCS2510 is a 1.4 GHz current feedback monolithic operational amplifier featuring high slew rate and low differential gain and phase error. The current feedback architecture allows for a superior bandwidth and low power consumption.
Features http://onsemi.com MARKING DIAGRAM
5 5 1 SOT23-5 (TSOP-5) SN SUFFIX CASE 483 YB1AYW G 1
* * * * * * * * * * * * * *
-3.0 dB Small Signal BW (AV = +2.0, VO = 0.5 Vp-p) 1.4 GHz Typ Slew Rate 2500 V/ms Supply Current 12 mA Input Referred Voltage Noise 5.0 nV/ Hz THD -69 dB (f = 5.0 MHz, VO = 2.0 Vp-p) Output Current 120 mA Pin Compatible with AD8001, TSH330, OPA658 This is a Pb-Free Device High Resolution Video Line Driver High-Speed Instrumentation Wide Dynamic Range IF Amp Set Top Box NTSC/PAL/HDTV
6
Applications
YB1 A Y W G
= Specific Device Code = Assembly Location = Year = Work Week = Pb-Free Package
SOT23-5 (TSOP-5) PINOUT OUT VEE +IN 1 + 2 3 (Top View) - 4 -IN 5 VCC
NORMALIZED GAIN (dB)
3 0 -3
VOUT = 0.5 VPP
ORDERING INFORMATION
VOUT = 1.0 VPP Device NCS2510SNT1G Package TSOP-5 (Pb-Free) Shipping 3000/Tape & Reel
-6 VOUT = 2.0 VPP -9 -12 -15 AV = +2 VS = 5 V RF = 330 W RL = 150 W 10k 100k 100M 1M 10M FREQUENCY (Hz) 1G 10G
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.
Figure 1. Frequency Response: Gain (dB) vs. Frequency Av = +2.0
(c) Semiconductor Components Industries, LLC, 2006
1
March, 2006 - Rev. 1
Publication Order Number: NCS2510/D
NCS2510
PIN FUNCTION DESCRIPTION
Pin (SOT23/SC70) 1 Symbol OUT Function Output Equivalent Circuit
VCC ESD OUT
VEE
2 3
VEE +IN
Negative Power Supply Non-inverted Input
ESD +IN VCC
ESD -IN
VEE
4 5
-IN VCC
Inverted Input Positive Power Supply
VCC
See Above
+IN -IN
OUT
CC
VEE
Figure 2. Simplified Device Schematic
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NCS2510
ATTRIBUTES
Characteristics ESD Human Body Model Machine Model Charged Device Model Moisture Sensitivity (Note 2) Flammability Rating Oxygen Index: 28 to 34 2.0 kV (Note 1) 200 V 1.0 kV Level 1 UL 94 V-0 @ 0.125 in Value
1. 0.8 kV between the input pairs +IN and -IN pins only. All other pins are 2.0 kV. 2. For additional information, see Application Note AND8003/D.
MAXIMUM RATINGS
Parameter Power Supply Voltage Input Voltage Range Input Differential Voltage Range Output Current Maximum Junction Temperature (Note 3) Operating Ambient Temperature Storage Temperature Range Power Dissipation Thermal Resistance, Junction-to-Air Symbol VS VI VID IO TJ TA Tstg PD RqJA Rating 11 vVS vVS 120 150 -40 to +85 -60 to +150 (See Graph) 121 Unit Vdc Vdc Vdc mA C C C mW C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 3. Power dissipation must be considered to ensure maximum junction temperature (TJ) is not exceeded.
MAXIMUM POWER DISSIPATION
1800 Maximum Power Dissipation (mW) 1600 1400 1200 1000 800 600 400 200 0 -50 -25 0 25 100 50 75 Ambient Temperature (C) 125 150
The maximum power that can be safely dissipated is limited by the associated rise in junction temperature. For the plastic packages, the maximum safe junction temperature is 150C. If the maximum is exceeded momentarily, proper circuit operation will be restored as soon as the die temperature is reduced. Leaving the device in the "overheated'' condition for an extended period can result in device damage. To ensure proper operation, it is important to observe the derating curves.
Figure 3. Power Dissipation vs. Temperature
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AC ELECTRICAL CHARACTERISTICS (VCC = +5.0 V, VEE = -5.0 V, TA = -40C to +85C, RL = 150 W to GND, RF = 330 W, AV = +2.0, Enable is left open, unless otherwise specified). Symbol Characteristic Conditions Min Typ Max Unit
FREQUENCY DOMAIN PERFORMANCE BW Bandwidth 3.0 dB Small Signal 3.0 dB Large Signal 0.1 dB Gain Flatness Bandwidth Differential Gain Differential Phase MHz AV = +2.0, VO = 0.5 Vp-p AV = +2.0, VO = 2.0 Vp-p AV = +2.0 AV = +2.0, RL = 150 W, f = 3.58 MHz AV = +2.0, RL = 150 W, f = 3.58 MHz 1400 650 120 0.02 0.02 MHz %
GF0.1dB dG dP
TIME DOMAIN RESPONSE SR ts tr tf Slew Rate Settling Time 0.1% Rise and Fall Time AV = +2.0, Vstep = 2.0 V AV = +2.0, Vstep = 2.0 V (10%-90%) AV = +2.0, Vstep = 2.0 V 2500 13 1.5 ns V/ms ns
HARMONIC/NOISE PERFORMANCE THD HD2 HD3 IP3 SFDR eN iN Total Harmonic Distortion 2nd Harmonic Distortion 3rd Harmonic Distortion Third-Order Intercept Spurious-Free Dynamic Range Input Referred Voltage Noise Input Referred Current Noise f = 5.0 MHz, VO = 2.0 Vp-p f = 5.0 MHz, VO = 2.0 Vp-p f = 5.0 MHz, VO = 2.0 Vp-p f = 10 MHz, VO = 1.0 Vp-p f = 5.0 MHz, VO = 2.0 Vp-p f = 1.0 MHz f = 1.0 MHz, Inverting f = 1.0 MHz, Non-Inverting -69 -73 -73 34 73 5.0 20 30 dB dBc dBc dBm dBc
nV pA
Hz Hz
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NCS2510
DC ELECTRICAL CHARACTERISTICS (VCC = +5.0 V, VEE = -5.0 V, TA = -40C to +85C, RL = 150 W to GND, RF = 330 W, AV = +2.0, Enable is left open, unless otherwise specified). Symbol Characteristic Conditions Min Typ Max Unit
DC PERFORMANCE VIO DVIO/DT IIB DIIB/DT Input Offset Voltage Input Offset Voltage Temperature Coefficient Input Bias Current Input Bias Current Temperature Coefficient +Input (Non-Inverting), VO = 0 V -Input (Inverting), VO = 0 V (Note 4) +Input (Non-Inverting), VO = 0 V -Input (Inverting), VO = 0 V "3.0 (See Graph) +Input (Non-Inverting) -Input (Inverting) 40 -10 0 6.0 "3.0 "6.0 +40 -10 "35 "35 +10 mV mV/C mA nA/C
INPUT CHARACTERISTICS VCM CMRR RIN CIN Input Common Mode Voltage Range (Note 4) Common Mode Rejection Ratio Input Resistance Differential Input Capacitance "4.0 50 150 70 1.0 V dB kW W pF
OUTPUT CHARACTERISTICS ROUT VO IO Output Resistance Output Voltage Range Output Current Closed Loop Open Loop "3.0 "90 0.1 13 "4.0 "120 W V mA
POWER SUPPLY VS IS PSRR Operating Voltage Supply Power Supply Current Power Supply Rejection Ratio VO = 0 V (See Graph) 6.0 40 10 12 55 18 V mA dB
4. Guaranteed by design and/or characterization.
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AC ELECTRICAL CHARACTERISTICS (VCC = +2.5 V, VEE = -2.5 V, TA = -40C to +85C, RL = 150 W to GND, RF = 330 W, AV = +2.0, Enable is left open, unless otherwise specified). Symbol Characteristic Conditions Min Typ Max Unit
FREQUENCY DOMAIN PERFORMANCE BW Bandwidth 3.0 dB Small Signal 3.0 dB Large Signal 0.1 dB Gain Flatness Bandwidth Differential Gain Differential Phase MHz AV = +2.0, VO = 0.5 Vp-p AV = +2.0, VO = 1.0 Vp-p AV = +2.0 AV = +2.0, RL = 150 W, f = 3.58 MHz AV = +2.0, RL = 150 W, f = 3.58 MHz 800 450 100 0.02 0.02 MHz %
GF0.1dB dG dP
TIME DOMAIN RESPONSE SR ts tr tf Slew Rate Settling Time 0.1% Rise and Fall Time AV = +2.0, Vstep = 1.0 V AV = +2.0, Vstep = 1.0 V (10%-90%) AV = +2.0, Vstep = 1.0 V 1500 10 1.2 ns V/ms ns
HARMONIC/NOISE PERFORMANCE THD HD2 HD3 IP3 SFDR eN iN Total Harmonic Distortion 2nd Harmonic Distortion 3rd Harmonic Distortion Third-Order Intercept Spurious-Free Dynamic Range Input Referred Voltage Noise Input Referred Current Noise f = 5.0 MHz, VO = 1.0 Vp-p f = 5.0 MHz, VO = 1.0 Vp-p f = 5.0 MHz, VO = 1.0 Vp-p f = 10 MHz, VO = .5 Vp-p f = 5.0 MHz, VO = 1.0 Vp-p f = 1.0 MHz f = 1.0 MHz, Inverting f = 1.0 MHz, Non-Inverting -58 -61 -61 28 61 5.0 20 30 dB dBc dBc dBm dBc
nV pA
Hz Hz
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NCS2510
DC ELECTRICAL CHARACTERISTICS (VCC = +2.5 V, VEE = -2.5 V, TA = -40C to +85C, RL = 150 W to GND, RF = 330 W, AV = +2.0, Enable is left open, unless otherwise specified). Symbol Characteristic Conditions Min Typ Max Unit
DC PERFORMANCE VIO DVIO/DT IIB DIIB/DT Input Offset Voltage Input Offset Voltage Temperature Coefficient Input Bias Current Input Bias Current Temperature Coefficient +Input (Non-Inverting), VO = 0 V -Input (Inverting), VO = 0 V (Note 5) +Input (Non-Inverting), VO = 0 V -Input (Inverting), VO = 0 V "1.1 (See Graph) +Input (Non-Inverting) -Input (Inverting) 40 -10 0 6.0 "3.0 "6.0 +40 -10 "35 "35 +10 mV mV/C mA nA/C
INPUT CHARACTERISTICS VCM CMRR RIN CIN Input Common Mode Voltage Range (Note 5) Common Mode Rejection Ratio Input Resistance Differential Input Capacitance "1.5 50 150 70 1.0 V dB kW W pF
OUTPUT CHARACTERISTICS ROUT VO IO Output Resistance Output Voltage Range Output Current Closed Loop Open Loop "1.1 "90 0.1 13 "1.5 "120 W V mA
POWER SUPPLY VS IS PSRR Operating Voltage Supply Power Supply Current - Enabled Power Supply Rejection Ratio VO = 0 V (See Graph) 6.0 40 5.0 11 55 18 V mA dB
5. Guaranteed by design and/or characterization.
VIN
+ -
VOUT
RF RF
RL
Figure 4. Typical Test Setup (AV = +2.0, RF = 330 W, RL = 150 W)
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6 NORMALIZED GAIN (dB) 3 0 -3 VOUT = 1.0 VPP -6 VOUT = 2.0 VPP -9 -12 -15 AV = +2 VS = 5 V RF = 330 W RL = 150 W 10k 100k 100M 1M 10M FREQUENCY (Hz) 1G 10G VOUT = 0.5 VPP 6 3 0 -3 VOUT = 0.5 VPP -6 VOUT = 1.0 VPP -9 -12 -15 10k 100k 1M 10M 100M FREQUENCY (Hz) 1G 10G AV = +1 VS = 5 V RF = 330 W RL = 150 W
NORMALIZED GAIN (dB)
Figure 5. Frequency Response: Gain (dB) vs. Frequency AV = +2.0
Figure 6. Frequency Response: Gain (dB) vs. Frequency AV = +1.0
6 3 0 -3 -6 -9 -12 -15 10k 100k 1M 10M 100M FREQUENCY (Hz) 1G 10G VOUT = 1.0 VPP VS = 5 V RF = 330 W RL = 150 W AV = +2 AV = +1 NORMALIZED GAIN (dB)
6 3 0 AV = +2 -3 -6 -9 -12 -15 10k 100k 1M 10M 100M FREQUENCY (Hz) VOUT = 0.5 VPP VS = 5 V RF = 330 W RL = 150 W
AV = +1
NORMALIZED GAIN (dB)
1G
10G
Figure 7. Large Signal Frequency Response Gain (dB) vs. Frequency
Figure 8. Small Signal Frequency Response Gain (dB) vs. Frequency
VS = 5 V
VS = 5 V
Figure 9. Small Signal Step Response Vertical: 500 mV/div Horizontal: 10 ns/div
Figure 10. Large Signal Step Response Vertical: 2 V/div Horizontal: 10 ns/div
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-50 -55 DISTORTION (dB) -60 THD -65 -70 -75 -80 1 10 FREQUENCY (MHz) 100 HD2 HD3 -75 -80 0 HD3 0.5 1 VOUT = 2 VPP VS = 5 V RF = 330 W RL = 150 W -50 -55 DISTORTION (dB) -60 THD -65 HD2 -70 f = 5 MHz VS = 5 V RF =330 W RL = 150 W
1.5
2
2.5
3
3.5
4
4.5
VOUT (VPP)
Figure 11. THD, HD2, HD3 vs. Frequency
Figure 12. THD, HD2, HD3 vs. Frequency
60 VS = 5 V VOLTAGE NOISE (nV/Hz) 50 40 30 20 10 0 100 1k 10k FREQUENCY (Hz) 100k 1M
-25 VS = 5 V -30 -35 -40 -45 -50 -55 10 k 100 k 1M FREQUENCY (Hz) 10 M 100 M
Figure 13. Input Referred Voltage Noise vs. Frequency
CMRR (dB)
Figure 14. CMRR vs. Frequency
0 DIFFERENTIAL GAIN (%) -10 -20 -30 -40 +5 V -50 -5 V -60 10 k 100 k 1M FREQUENCY (Hz) 10 M 100 M
0.03 10 MHz 0.02 20 MHz 0.01 0 -0.01 -0.02 -0.03 -0.8 4.43 MHz VS = 5 V RL = 150 W AV = +2 -0.6 -0.4 -0.2 0 0.2 0.4 OFFSET VOLTAGE (V) 0.6 0.8 3.58 MHz 50 MHz
PSRR (dB)
Figure 15. PSRR vs. Frequency
Figure 16. Differential Gain
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0.03 20 MHz DIFFERENTIAL PHASE () 0.02 3.58 MHz 0.01 0 -0.01 -0.02 50 MHz -0.03 -0.8 -0.6 VS = 5 V RL = 150 W AV = +2 0.6 0.8 13 10 MHz CURRENT (mA) 12 11 10 9 8 7 6 -0.4 -0.2 0 0.2 0.4 OFFSET VOLTAGE (V) 4 5 6 7 8 9 POWER SUPPLY VOLTAGE (V) 10 11 25C -40C 85C 14
4.43 MHz
Figure 17. Differential Phase
Figure 18. Supply Current vs. Power Supply (Enabled)
9 85C OUTPUT VOLTAGE (VPP) 8 7 25C 6 -40C 5 4 3 2 4 5 7 9 6 8 POWER SUPPLY VOLTAGE (V) 10 11 TRANSIMPEDANCE (W)
1M f = 5 MHz VS = 5 V RF = 330 W RL = 150 W
100k
10k
1k
100 10 10k
100k
1M
10M
100M
1G
10G
FREQUENCY (Hz)
Figure 19. Output Voltage Swing vs. Supply Voltage
Figure 20. Transimpedance (ROL) vs. Frequency
10 OUTPUT RESISTANCE (W) VS = 5 V NORMALIZED GAIN (dB)
15 12 9 6 3 0 -3 -6 -9 AV = +2 VOUT = 0.5 VPP VS = 5 V RF = 330 W RL = 150 W 100k 1M 10M 47 pF 100 pF
10 pF
1
0.1
0.01 10k
100k
1M FREQUENCY (Hz)
10M
100M
-12 -15 10k
100M
1G
10G
FREQUENCY (Hz)
Figure 21. Closed-Loop Output Resistance vs. Frequency
Figure 22. Frequency Response vs. Capacitive Load
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General Design Considerations
The current feedback amplifier is optimized for use in high performance video and data acquisition systems. For current feedback architecture, its closed-loop bandwidth depends on the value of the feedback resistor. The closed-loop bandwidth is not a strong function of gain, as is for a voltage feedback amplifier, as shown in Figure 23.
21 18 15 12 9 6 3 0 -3 -6 -9 -12 -15 -18 -21
use a current feedback amplifier with the output shorted directly to the inverting input.
Printed Circuit Board Layout Techniques
RF = 100 W RF = 150 W RF = 200 W RF = 270 W RF = 330 W RF = 400 W RF = 450 W AV = +2 VS = 5 V RL = 150 W 10 k 100 k 1M 10 M RF = 500 W
GAIN (dB)
Proper high speed PCB design rules should be used for all wideband amplifiers as the PCB parasitics can affect the overall performance. Most important are stray capacitances at the output and inverting input nodes as it can effect peaking and bandwidth. A space (3/16 is plenty) should be left around the signal lines to minimize coupling. Also, signal lines connecting the feedback and gain resistors should be short enough so that their associated inductance does not cause high frequency gain errors. Line lengths less than 1/4 are recommended.
Video Performance
100 M
1G
10 G
FREQUENCY (Hz)
This device designed to provide good performance with NTSC, PAL, and HDTV video signals. Best performance is obtained with back terminated loads as performance is degraded as the load is increased. The back termination reduces reflections from the transmission line and effectively masks transmission line and other parasitic capacitances from the amplifier output stage.
ESD Protection
Figure 23. Frequency Response vs. RF
The -3.0 dB bandwidth is, to some extent, dependent on the power supply voltages. By using lower power supplies, the bandwidth is reduced, because the internal capacitance increases. Smaller values of feedback resistor can be used at lower supply voltages, to compensate for this affect.
Feedback and Gain Resistor Selection for Optimum Frequency Response
A current feedback operational amplifier's key advantage is the ability to maintain optimum frequency response independent of gain by using appropriate values for the feedback resistor. To obtain a very flat gain response, the feedback resistor tolerance should be considered as well. Resistor tolerance of 1% should be used for optimum flatness. Normally, lowering RF resistor from its recommended value will peak the frequency response and extend the bandwidth while increasing the value of RF resistor will cause the frequency response to roll off faster. Reducing the value of RF resistor too far below its recommended value will cause overshoot, ringing, and eventually oscillation. Since each application is slightly different, it is worth some experimentation to find the optimal RF for a given circuit. A value of the feedback resistor that produces X0.1 dB of peaking is the best compromise between stability and maximal bandwidth. It is not recommended to
All device pins have limited ESD protection using internal diodes to power supplies as specified in the attributes table (see Figure 24). These diodes provide moderate protection to input overdrive voltages above the supplies. The ESD diodes can support high input currents with current limiting series resistors. Keep these resistor values as low as possible since high values degrade both noise performance and frequency response. Under closed-loop operation, the ESD diodes have no effect on circuit performance. However, under certain conditions the ESD diodes will be evident. If the device is driven into a slewing condition, the ESD diodes will clamp large differential voltages until the feedback loop restores closed-loop operation. Also, if the device is powered down and a large input signal is applied, the ESD diodes will conduct. NOTE: Human Body Model for +IN and -IN pins are rated at 0.8kV while all other pins are rated at 2.0kV.
VCC
External Pin VEE
Internal Circuitry
Figure 24. Internal ESD Protection
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PACKAGE DIMENSIONS
TSOP-5 SN SUFFIX CASE 483-02 ISSUE E
D
5 1 2 4 3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. A AND B DIMENSIONS DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MILLIMETERS MIN MAX 2.90 3.10 1.30 1.70 0.90 1.10 0.25 0.50 0.85 1.05 0.013 0.100 0.10 0.26 0.20 0.60 1.25 1.55 0_ 10 _ 2.50 3.00 INCHES MIN MAX 0.1142 0.1220 0.0512 0.0669 0.0354 0.0433 0.0098 0.0197 0.0335 0.0413 0.0005 0.0040 0.0040 0.0102 0.0079 0.0236 0.0493 0.0610 0_ 10 _ 0.0985 0.1181
S
B
L G A J C 0.05 (0.002) H K M
DIM A B C D G H J K L M S
SOLDERING FOOTPRINT*
1.9 0.074
0.95 0.037
2.4 0.094 1.0 0.039 0.7 0.028
SCALE 10:1
mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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NCS2510/D

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